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Signal Integrity Analysis Using Statistical Methods

Signal Integrity Analysis Using Statistical Methods

The current electronics industry drive for miniaturization of electronic products will eventually call for smaller IC package design, high speed interfaces and complex, dense PCB designs. The recent advancements in PCB designs have facilitated the manufacturing of high-density, multi-layer PCBs, where interface speeds can vary from 1.5Gbps to 12Gbps and more. The need for comprehensive analysis of these interfaces during the early stages of design becomes very critical in order to avoid signal integrity and EMI/EMC-related issues during system testing and certification.

This paper presents a method to leverage the advantages of statistical methods for signal integrity analysis. This paper will describe how we can simplify signal integrity analysis by analytically reducing the number of simulation iterations and predicting the worst and best case conditions and results for validating the high speed interfaces using statistical tools such as JMP® and Minitab®.

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