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Thermal Management in Electronic Equipment

Thermal Management in Electronic Equipment

Abstract

Development in the electronics industry has come a long way from nascent low performing devices to advanced devices with high computational speed and power. The advancement in the industry led to an exponential increase in power densities, which in turn drove the innovation of smarter and smaller products. These advanced technologies, coupled with miniaturization requirements, guided innovation-driven thermal management in electronic devices. Thermal management is essential in electronics, as it improves reliability and enhances performance by removing heat generated by the devices. 

This paper highlights the development and challenges faced in the thermal management of electronic equipment in various domains. It gives an overview of innovative cooling solutions developed over the years. It presents HCL case studies in various domains such as medical, consumer, aerospace and defense, and automotive electronics. It also gives a process flow chart which demonstrates the thermal methodology of electronic equipment in general.

Excerpts from the Paper
If we observe the statistics of market trends and consumer demand in electronics, there has been an explosive growth in the industry. The tremendous growth in electronic equipment demands innovative solutions to the new challenges of thermal management. The major challenges on the thermal management front can be understood by the heat dissipation of electronic devices, which vary from 5 W/cm2 on a PWB to 2000 W/cm2 for a semiconductor laser. Providing cooling solution for former heat flux is manageable, but for later heat flux is very difficult, and needs novel cooling solutions. 
The latest technologies in the thermal management arena function in and around the basic heat transfer modes, i.e. conduction, convection (natural and forced) and radiation. Development has reached a stage where the technologies overlap the basic functional industrial domains.

 

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