Driving ADAS innovation with production-ready Radar SoC engineering
Overview
As automotive manufacturers accelerate investments in Advanced Driver Assistance Systems (ADAS) and autonomous driving, radar systems have become essential for enabling real-time vehicle perception, collision avoidance and driver safety. To support this transition, a global automotive semiconductor company set out to develop a next-generation Radar SoC capable of delivering high-speed radar signal processing with automotive-grade reliability and functional safety compliance.
The program involved a highly complex multi-die architecture to support advanced radar processing workloads. Along with achieving real-time performance, the client also needed to ensure seamless subsystem integration, production scalability and compliance with stringent automotive reliability standards.
To help accelerate execution, the client collaborated with HCLTech as an end-to-end semiconductor engineering partner. Leveraging deep expertise across automotive and semiconductor engineering, We supported the complete SoC lifecycle from design and verification to physical implementation, functional safety and production enablement, helping the client move faster from development to production readiness.
The Challenges
Developing a safety-critical Radar SoC for ADAS introduced multiple engineering and production challenges:
- Integrating radar processing, compute, connectivity and safety subsystems within a complex multi-die architecture
- Ensuring stable high-speed performance across multiple clock domains and real-time radar workloads
- Achieving functional safety and automotive reliability compliance for production deployment
- Accelerating silicon readiness and production ramp-up within aggressive timelines
- Managing design complexity while optimizing power, performance and area efficiency

The Objective
Our objective was simple—to enable faster, scalable and more efficient development of a next-gen automotive Radar SoC by delivering integrated, end-to-end semiconductor engineering support across the design-to-production lifecycle. We focused on improving subsystem integration across radar processing, compute, connectivity and safety components while ensuring compliance with stringent functional safety and automotive reliability standards. Our approach also emphasized optimizing power, performance and area efficiency while reducing design complexity and accelerating silicon readiness. Ultimately, we supported a seamless transition from development to high-volume production deployment, helping the client meet aggressive timelines and advance next-generation ADAS and autonomous driving capabilities.
The Solution
HCLTech delivered coordinated semiconductor engineering support across design, verification, physical implementation, safety engineering and manufacturing enablement to help the client accelerate Radar SoC execution.

Key highlights
- Supported integration of radar processing, compute and safety subsystems for a next-generation automotive Radar SoC.
- Enabled verification of critical radar processing functions, high-speed interfaces and system-level functionality to improve design stability and reliability.
- Implemented optimized RTL-to-signoff methodologies to improve power, performance and area efficiency across the SoC.
- Integrated functional safety mechanisms and validation workflows aligned with automotive compliance requirements.
- Supported timing closure, power optimization and physical verification activities to improve implementation efficiency and reduce design risks.
- Enabled manufacturing test development, silicon qualification and production ramp readiness for automotive deployment.
- Leveraged HCLTech’s Advanced Semiconductor Lab (ASL) capabilities for post-silicon validation, reliability qualification and advanced diagnostics to accelerate production readiness.
The Impact
HCLTech helped accelerate execution and strengthen production readiness for a next-generation automotive radar platform.

- Enabled production testing for over 100,000 devices, supporting readiness for high-volume automotive manufacturing.
- Achieved ~22% area reduction, 5x reduction in clock toggle activity and ~27% lower power leakage compared to legacy designs.
- Improved functional safety and automotive reliability readiness through integrated validation, qualification and fault analysis support.
Looking Ahead
The engagement established a scalable and repeatable execution model for future automotive semiconductor and ADAS programs.
By combining end-to-end semiconductor engineering, functional safety expertise and production readiness support, HCLTech helped the client accelerate the transition from Radar SoC development to automotive-scale deployment while improving execution predictability, reducing program risk and enabling faster innovation for next-generation mobility platforms.
