Overview
Europe stands at an inflection point in the global semiconductor race. Backed by the €43 billion European Chips Act and a coordinated push for technological sovereignty, the continent is attracting landmark fab investments from TSMC's joint venture in Dresden to Intel's advanced fab in Magdeburg, signaling a structural shift in how Europe designs, manufactures and scales semiconductor capability.
At HCLTech, we bring over 30 years of unbroken semiconductor heritage, end-to-end engineering depth across chip and equipment lifecycles and AI-powered platforms already transforming how leading semiconductor enterprises operate. Our Spec-to-Platform model owns the full silicon journey from product specification through design, verification, advanced packaging, production test and qualification, delivering the speed and first-time-right outcomes European companies need in an era of compressed timelines.
We partner with 8 of the top 10 equipment OEMs, 8 of the top 10 chip companies and hold approved SoC partner status at all top 4 global foundries. Join us at SEMICON Europa 2026, Hall C2, Booth 337, to explore how our Chip2Intelligence approach is helping European semiconductor leaders move from incremental improvement to transformational outcomes.
Meet Us at SEMICON Europa 2026
Focus Areas
HCLTech's Spec-to-Platform model covers the complete silicon journey from initial product specification and architecture through front-end and back-end design, FPGA emulation, pre-silicon validation, advanced packaging, production testing and post-silicon qualification. One integrated team owns outcomes from the first RTL line to production-ready silicon, eliminating handoff risk and delivering the IP continuity that fragmented engagement models cannot provide. HCLTech is the only semiconductor engineering SI that bridges chip and equipment, design and manufacturing, new product development and installed base optimization.
HCLTech brings a unified engineering model spanning silicon, parts, platforms and manufacturing. Our Spec-to-Platform approach enables customers to engage a single engineering partner across the entire semiconductor lifecycle, reducing complexity and accelerating outcomes.
Key Highlights
- Spec-to-Silicon, Parts and Platform solutions with a proven track record
- Manufacturing enablement, fab operations and yield optimization
- NPD to lifecycle ownership for equipment platforms
Artificial Intelligence is reshaping semiconductor engineering, manufacturing and operations. HCLTech embeds AI throughout the semiconductor value chain, enabling faster design cycles, greater automation and improved engineering productivity.
Key Highlights
- 30% cycle time reduction across the silicon development lifecycle
- Intelligent equipment software engineering and platform automation
- Auto test flow generation for post-silicon and manufacturing test
- AI & Digital Co-Innovation Labs, UK
- Physical AI Lab, Budapest
- €19M Investment in Advanced Semiconductor Engineering Infrastructure
- 40,000 sq. ft. Advanced Semiconductor Lab for Post-Silicon Validation & Testing
- Scalable Engineering Excellence Across Europe and Beyond
- 10+ dedicated labs worldwide, including a GenAI Lab in Singapore
- 60+ customer equipment platforms operational
Why HCLTech
Semi Engineering SI — Leading design-services player with over 30 years of unbroken semiconductor heritage
SI with Top 4 Fab SoC Partner Status — Approved SoC partner at Intel, Samsung, TSMC and GlobalFoundries with privileged PDK access
Year Relationships — Driving transformation for all of the top 5 Equipment Companies, 8 of the top 10 Chip companies and 3 of the top 4 ISVs
Engineers driving R&D breakthroughs
Tapeouts across multiple foundries and process nodes
First Silicon Success Rate
Highest Investments — Customer Labs, 10k Clean Rooms, Solution Frameworks
Chip-to-Cloud, Spec-to-Platform — the only SI that bridges chip design and equipment engineering with proprietary solution frameworks
Client Testimonials
Analyst Accolades
HCLTech recognized as a Leader in Everest Group's Semiconductor Engineering Services PEAK Matrix Assessment 2024
Learn moreHCLTech recognized as a Leader in ISG Digital Engineering Services, 2024
Learn moreHCLTech rated Customers' Choice in all six active Gartner Peer Insights Voice of the Customer reports
Mehr erfahrenHCLTech wins Intel's EPIC Outstanding Supplier Award
Mehr erfahren











































Let's Engineer What's Next — Together
Meet our semiconductor leaders at Booth #3193 to explore how HCLTech is helping the world's leading equipment OEMs and chip companies harness AI, scale engineering and own outcomes end-to-end. Book your meeting today.








