At Booth #3193 in Kuala Lumpur, HCLTech engaged equipment OEMs and chip companies on how AI-powered engineering is accelerating chip design and manufacturing across Southeast Asia.

Understand how banks leverage smart options to suit their specific digital touchpoints transformation strategy. Engage with a great panel of leaders across Temenos, leading European banks and HCLTech.

Meet us at VECS 2026, to discover how we reduce friction across SDV programs and transform complexity into business velocity through AI-driven fast, cost-effective and traceable engineering decisions