Fab Operations, Delivered as an Engineering Discipline
Fabs and OSATs run on a simple, unforgiving arithmetic: uptime, yield, cycle time and cost per wafer. Moving any of them in the right direction takes people who have stood at the tool—engineers fluent in equipment maintenance, process engineering, MES ecosystems and cleanroom operations, deployed in models with real accountability.
We deliver fab engineering programs inside client environments across the US, Taiwan, India and beyond from equipment install and qualification at greenfield fabs to KPI-led managed operations covering thousands of tools. We span the full domain—wafer fabrication front-end processes, ATMP and back-end, test engineering and the digital layer of MES, automation and analytics that ties a modern fab together.
Equipment uptime achieved across fab operations
Tools under management
Fabs and cleanrooms operated for a single client program
Engineers deployed in cleanroom and fabrication environments on a single engagement
Global MES deployments
Key Differentiators
Inside-the-fab depth
hands-on across the full chip-making process, from front-end wafer fabrication to ATMP and back-end
Equipment OEM heritage
nearly three decades co-engineering the very tools fabs run, giving our fab engineers tool-level fluency competitors lack
Proprietary IP
SIMQUALIFY, Plant-in-a-Box, MES Test Automation and the HCLTech AI Force platform applied to fab analytics
Manufacturing commitment
the HCL–Foxconn OSAT joint venture puts us on the operating side of the industry, not just the services side
Accountable operating models
KPI and SLA-led managed services with published performance, not staff augmentation
Labs and Infrastructure
Manufacturing Infrastructure with Skin in the Game
- Advanced Semiconductor Lab — post-silicon validation, qualification and failure analysis supporting NPI and yield stabilization
- 25,000+ sq. ft. Class 10K ATE cleanroom with tri-temp wafer probers and package handlers
- Cleanroom and equipment labs supporting maintenance training and process development
FAQ
We deliver end-to-end fab operations support, including equipment installation, maintenance and process engineering. Our services extend to cleanroom operations, test engineering and MES implementation across global fab environments. These run under KPI- and SLA-led managed services models for full accountability.
Yes — we implement and sustain MES, MOM, SCADA and LIMS systems across semiconductor manufacturing environments. Our deployments span multiple global sites for leading fabs and OSATs. Our Plant-in-a-Box framework packages this into a rapidly deployable kit, cutting rollout timelines.
We bring hands-on experience installing and ramping fab equipment across litho, etch, deposition and metrology tools. Our teams have supported hyperscale and 300mm fab programs across Taiwan, the US and India. This includes multi-vendor tool support and capacity ramp execution.
Yes — we operate under KPI - and SLA-led managed services models across fab and OSAT operations. We define and operationalize KPIs, services and deliverables across process, equipment and MES functions. This gives fab operators end-to-end visibility and an accountable partner.
We apply AI across MES optimization, predictive maintenance and yield analytics for fab and OSAT manufacturing operations. Digital twin accelerators like MFGTwin simulate plant operations for data-driven manufacturing decisions. Together, these tools turn production data into faster, more confident decisions.
We deliver back-end assembly, test and OSAT services across global fab and manufacturing operations. In India, we are a co-investor in the HCL-Foxconn joint venture, building the country's first display driver IC and OSAT facility. This reflects our manufacturing commitment.
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