The Shift to AI Semiconductor Platforms
AI is changing how semiconductors are designed, manufactured and evaluated. Performance now depends on how compute, memory, connectivity, advanced packaging and software work together. This Omdia whitepaper, in partnership with HCLTech, examines Taiwan’s role in powering AI infrastructure and how that role connects to a more distributed Asia Pacific production network, including Singapore, Malaysia, Vietnam and China.
Key Figures
TSMC’s share of the world’s leading-edge semiconductor production
Share of the global foundry-services market held by Taiwan-headquartered foundries
Share of the world’s server systems produced by Taiwanese ODMs
Inside the whitepaper
- The roles of Singapore, Malaysia, Vietnam and China in Asia’s AI semiconductor network and Taiwan’s place within it
- AI demand across industries and the semiconductor technologies behind it
- Advanced packaging’s role in AI performance and capacity planning
- The shift to rack-scale AI systems and its impact on compute, connectivity, power and cooling
- Taiwan’s strengths beyond leading-edge chips
- Five priorities for leaders: differentiation, partnerships, capacity and regional resilience
Leader Quote
AI semiconductor competition is no longer about who builds the fastest chip, but who delivers the best workload outcome. Performance now depends on compute, memory, packaging, connectivity and software being designed together from the start. That makes execution the real differentiator: the leaders will be those who can turn complex silicon ambition into scalable, production-ready platforms."
