Driving semiconductor manufacturing performance through fab operations, process engineering, MES and smart factory solutions.

Co-engineering semiconductor equipment across inspection, metrology, lithography, etch, deposition and ATE platforms.

Turnkey silicon engineering from spec to production parts—chip design, verification, validation and qualification across nodes from 180nm to 2nm.

Highlights from the evening with Arm & Samsung Foundry

Join HCLTech and India Chip at Booth 946, SEMICON India 2026, to explore AI-powered engineering, from chip design to manufacturing in India and a virtual walkthrough of our ASL Lab.

HCLTech developed SoC for next-gen automotive keyless entry for enabling seamless, connected vehicle access for modern automotive systems

Accelerate telecom silicon innovation with HCLTech's end-to-end ASIC, FPGA and SoC engineering services. From architecture and RTL to tape-out, validation and production, we help telecom OEMs.

AI is redrawing the boundaries of the telecommunications, media and tech (TMT) sector and collapsing the lines between connectivity, computing, content and devices.

Empowering an AI-driven future where intelligence defines competitive advantage for TMT organizations.

Explores how AI-defined vehicles enable adaptive intelligence, continuous evolution, and new revenue models, redefining automotive experience and lifecycle value beyond traditional SDVs.

Vehicles are evolving into intelligent edge systems via software updates and connected services. Semiconductor strength, clear architectures, and disciplined execution will shape future mobility

Discover how HCLTech’s VeriFast™ framework accelerated image co-processor development, enabling first-pass silicon success and an 8-week reduction in verification time.