Architecture and microarchitecture, RTL design, design verification (UVM, formal), DFT, physical design and signoff, analog and mixed-signal design — delivered across ASIC, FPGA, SoC and chiplet programs, including ISO 26262 and AEC-Q100 compliant automotive silicon.

Virtual prototyping, FPGA and emulation, test chips, MPW prototypes and prototype packaging and assembly — to de-risk design decisions before volume commitment.

Functional and electrical interface validation, power and performance characterization, protocol testing and certification, reliability testing — finding deviations before they become respins.

Routability feasibility, PLOC definition, bonding diagrams and substrate layouts optimized for performance and manufacturability.

Full JEDEC JESD22 and AEC-Q100 qualification — HTOL, HAST, temperature cycling, ESD and latch-up with integrated failure analysis for rapid root cause.

Manufacturing test engineering (ATE), device qualification and yield stabilization, proto and production parts delivery, supplier and BOM management through our foundry and OSAT ecosystem.

Flexible engagement models tailored to different stages of the silicon development lifecycle, including Professional Services/COT, Full ASIC Services, RTL/Netlist to Parts, Architecture to Parts, Spec to Platform and Spec to Parts (PRD to production-ready parts)

Bring-up, debug, bench characterization, wafer probing

Wafer sort and final test across industry-standard platforms

AEC-Q100 and JEDEC JESD22 — HTOL, HAST, ESD, temperature cycling, latch-up

Optical inspection, 3D X-ray, Micro CT, CSAM, wafer micro-probing, SEM, FIB cross-sectioning and circuit edit

Vacuum reflow, 3D inspection, flying probe — prototype to low/mid-volume builds