SEMICON Europa 2026

Overview

Europe stands at an inflection point in the global race. Backed by the €43 billion European Chips Act and a coordinated push for technological sovereignty, the continent is attracting landmark fab investments from TSMC's joint venture in Dresden to Intel's advanced fab in Magdeburg, signaling a structural shift in how Europe designs, manufactures and scales semiconductor capability.

At HCLTech, we bring over 30 years of unbroken semiconductor heritage, end-to-end engineering depth across chip and equipment lifecycles and AI-powered platforms already transforming how leading semiconductor enterprises operate. Our Spec-to-Platform model owns the full silicon journey from product specification through design, verification, advanced packaging, production test and qualification, delivering the speed and first-time-right outcomes European companies need in an era of compressed timelines.

We partner with 8 of the top 10 equipment OEMs, 8 of the top 10 chip companies and hold approved SoC partner status at all top 4 global foundries. Join us at SEMICON Europa 2026, Hall C2, Booth 337, to explore how our Chip2Intelligence approach is helping European semiconductor leaders move from incremental improvement to transformational outcomes.

Meet Us at SEMICON Europa 2026

Extending Semiconductor Intelligence Across Industries

Semiconductor innovation increasingly determines how industries differentiate, scale and create new digital experiences. HCLTech extends its chip, embedded engineering, , , connectivity and product modernization capabilities beyond traditional semiconductor enterprises to help organizations build smarter products and platforms. Our Semi-to-Non-Semi approach connects silicon-level expertise with industry-specific engineering across automotive, hyperscalers, telecom and healthcare.

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Automotive

As vehicles become increasingly connected, autonomous and software-defined, HCLTech helps automotive companies accelerate innovation across vehicle electronics, embedded systems and next-generation mobility platforms. Our expertise spans MCUs, Battery Management Systems (BMS), ADAS and Software-Defined Vehicles (SDVs).

Capabilities: Software-Defined Vehicles (SDV), Battery Management Systems (BMS), ADAS, Automotive MCUs, Connected Mobility Platforms

Hyperscalers

The rise of AI and cloud computing is driving unprecedented demand for high-performance infrastructure. HCLTech supports hyperscalers with advanced semiconductor, networking and platform engineering capabilities that power next-generation data centers and AI-ready ecosystems.

Capabilities: Custom Silicon, SmartNIC Engineering, Data Center Platforms, High-Performance Networking, AI Infrastructure

Telecom

Telecom providers are evolving toward open, cloud-native and AI-enabled networks. HCLTech combines semiconductor and software expertise to help accelerate network transformation across Open RAN, 5G/6G, edge computing and intelligent network platforms.

Capabilities: Open RAN, 5G & 6G, Network Processors, SmartNICs, Edge Computing, Network Automation

Healthcare

Healthcare innovation increasingly depends on intelligent, connected and secure medical technologies. HCLTech enables next-generation healthcare solutions through expertise in medical devices, wearables, implantables, remote monitoring and AI-powered diagnostics.

Capabilities: Wearables, Implantables, Connected Medical Devices, Remote Patient Monitoring, AI-Powered Diagnostics

Focus Areas

Spec to Platform — End-to-End Chip Engineering

HCLTech's Spec-to-Platform model covers the complete silicon journey from initial product specification and architecture through front-end and back-end design, FPGA emulation, pre-silicon validation, advanced packaging, production testing and post-silicon qualification. One integrated team owns outcomes from the first RTL line to production-ready silicon, eliminating handoff risk and delivering the IP continuity that fragmented engagement models cannot provide. HCLTech is the only semiconductor engineering SI that bridges chip and equipment, design and manufacturing, new product development and installed base optimization.

One Engineering Partner. End-to-End.

HCLTech brings a unified engineering model spanning silicon, parts, platforms and manufacturing. Our Spec-to-Platform approach enables customers to engage a single engineering partner across the entire semiconductor lifecycle, reducing complexity and accelerating outcomes.

Key Highlights

  • Spec-to-Silicon, Parts and Platform solutions with a proven track record
  • Manufacturing enablement, fab operations and yield optimization
  • NPD to lifecycle ownership for equipment platforms
AI Across the Semiconductor Value Chain

Artificial Intelligence is reshaping semiconductor engineering, manufacturing and operations. HCLTech embeds AI throughout the semiconductor value chain, enabling faster design cycles, greater automation and improved engineering productivity.

Key Highlights

  • 30% cycle time reduction across the silicon development lifecycle
  • Intelligent equipment software engineering and platform automation
  • Auto test flow generation for post-silicon and manufacturing test
Driving Innovation Through Strategic Partnerships and Global Scale
  • AI & Digital Co-Innovation Labs, UK
  • Physical AI Lab, Budapest
  • €19M Investment in Advanced Semiconductor Engineering Infrastructure
  • 40,000 sq. ft. Advanced Semiconductor Lab for Post-Silicon Validation & Testing
    •  Scalable Engineering Excellence Across Europe and Beyond
    • 10+ dedicated labs worldwide, including a GenAI Lab in Singapore
    • 60+ customer equipment platforms operational

Solutions

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AIForce.Semi - AI-assisted Chip Design Acceleration

AIForce.Semi - AI-assisted Chip Design Acceleration

HCLTech's AIForce.Semi is an LLM-assisted chip design platform that delivers accurate, design-aware AI, grounded in a verified SoC Knowledge Graph. This enables near-zero hallucination and outputs that the engineers can trust. Powered by eight specialized agents built for the chip lifecycle, it also achieves 25% lower token usage through relationship-aware retrieval. The platform spans RTL, verification, synthesis/SDC, physical design and silicon validation. For semiconductor companies, this means faster engineering, lower costs, reduced review effort and reusable design knowledge that compounds across projects over time.

Spec-to-Parts Platform

Spec-to-Parts Platform

Seamless, end-to-end silicon development from initial product concept through to high-volume production. HCLTech's platform-driven approach ensures faster design realization and first-time-right results covering design verification, physical design, FPGA prototype and emulation, pre-silicon validation, advanced packaging, production testing and post-silicon qualification. This integrated, accountable model eliminates handoff risk and provides European chip companies with the engineering continuity they need to compete on a global node roadmap.

AI-Driven Smart Manufacturing and Yield Optimization

AI-Driven Smart Manufacturing and Yield Optimization

Maximize fab and OSAT efficiency with AI-powered digital twins. Our solutions deliver real-time monitoring, predictive maintenance, AI-driven process control and defect detection — reducing downtime, improving yield and enabling higher profitability across semiconductor manufacturing operations. As European fabs ramp up advanced nodes, intelligent manufacturing capability is a non-negotiable differentiator.

Turnkey Equipment Engineering and Lifecycle Services

Turnkey Equipment Engineering and Lifecycle Services

End-to-end equipment engineering from new product development through sustaining engineering, mature platform optimization and aftermarket services. HCLTech takes full accountability from design to deployment, shifting the model from staff augmentation to outcome-based delivery across mechanical, electrical and software engineering domains. This model is particularly relevant for European equipment OEMs seeking to extend value from their global installed base while investing in next-generation tool development.

AI Force for Semiconductor Software Engineering

AI Force for Semiconductor Software Engineering

An advanced AI and ML-based solution for intelligent software development and testing. Using GenAI technologies, AI Force augments development and test teams across semiconductor enterprises, enabling faster cycles, higher-quality code and lower costs for equipment software, control systems and automation platforms. For European OEMs managing complex, multi-generational software stacks, AI Force provides a scalable path to modernization without compromising schedule commitments.

Why HCLTech

#1

Semi Engineering SI — Leading design-services player with over 30 years of unbroken semiconductor heritage

Only

SI with Top 4 Fab SoC Partner Status — Approved SoC partner at Intel, Samsung, TSMC and GlobalFoundries with privileged PDK access

20+

Year Relationships — Driving transformation for all of the top 5 Equipment Companies, 8 of the top 10 Chip companies and 3 of the top 4 ISVs

45,000+

Engineers driving R&D breakthroughs

230+

Tapeouts across multiple foundries and process nodes

95%

First Silicon Success Rate

₹1320Cr+

Highest Investments — Customer Labs, 10k Clean Rooms, Solution Frameworks​

End-to-End

Chip-to-Cloud, Spec-to-Platform — the only SI that bridges chip design and equipment engineering with proprietary solution frameworks

Client Testimonials

At Eugenus, we pride ourselves on driving and HCLTech has been a crucial partner in helping us achieve our goals.”

Dr. Tejinder Singh

Chief Technology Officer - Eugenus, Inc.

Over two decades of collaboration with HCLTech has been critical to Teradyne in strengthening its position as a global leader in automatic test equipment market. The partnership has resulted in improved operational efficiency, cost savings and enhanced market competitiveness. The team has demonstrated a strong domain expertise combined with deep technical knowledge of Teradyne testers.”

Roy Chorev

VP - Product Dev., Semiconductor Test Division- Teradyne

Through Arm Total Design, our partners can leverage the expertise and support of other industry leaders to bring custom silicon solutions to market faster. HCLTech is a welcome addition to the ecosystem, and we are excited to see how they leverage their custom AI silicon capabilities and Arm Neoverse CSS to innovate next-generation solutions”

Guru Ganesan

President - ARM, India

Congratulations to HCLTech on receiving the EPIC Outstanding Supplier Award, Intel’s highest supplier recognition. As Intel transforms the world’s premier systems foundry for the AI era, HCLTech will play a significant role in delivering our winning strategy. HCLTech’s long-standing commitment to safety, quality, affordability, innovation, supplier diversity and sustainability sets a global benchmark for emulation.”

Keyvan Esfarjani

Chief Global Operations Officer – Intel

Our Leaders at Semicon Europa

Ameer Saithu
Ameer Saithu

Executive Vice President and Head, Global Semiconductor Business,
HCLTech

Aviad Yefet
Aviad Yefet

BU Head, Semi- Sales Europe, 
HCLTech

Timothy Holden
Timothy Holden

Semi Sales 
HCLTech

Satish Premanathan
Satish Premanathan

Sr. Vice President, Semiconductor Vertical
HCLTech

Gandhi Karuna
Gandhi Karuna

Director of semiconductor Practice 
HCLTech

Abdallah Harati
Abdallah Harati

Semi Sales 
HCLTech

Analyst Accolades

HCLTech recognized as a Leader in Everest Group's Semiconductor Engineering Services PEAK Matrix Assessment 2024

HCLTech recognized as a Leader in ISG Digital Engineering Services, 2024

HCLTech rated Customers' Choice in all six active Gartner Peer Insights Voice of the Customer reports

HCLTech wins Intel's EPIC Outstanding Supplier Award

Let's Engineer What's Next — Together

Meet our semiconductor leaders at Booth #3193 to explore how HCLTech is helping the world's leading equipment OEMs and chip companies harness AI, scale engineering and own outcomes end-to-end. Book your meeting today.

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ERS エンジニアリング イベント SEMICON Europa 2026