Overview
The semiconductor industry across Southeast Asia is entering a defining chapter — fueled by AI-led innovation, supply chain diversification and accelerating demand for advanced packaging, IC design and intelligent manufacturing. As Malaysia positions itself as a strategic hub in the global semiconductor ecosystem, the opportunity for equipment OEMs and chip companies to rethink how they engineer, build and scale has never been greater.
At HCLTech, we bring 27+ years of unbroken semiconductor heritage, end-to-end engineering depth across both equipment and chip lifecycles and AI-powered platforms that are already transforming how leading semiconductor enterprises operate. From GenAI-accelerated chip design and verification to smart manufacturing, lifecycle optimization and turnkey equipment ownership — we partner with 8 of the top 10 equipment OEMs, 8 of the top 10 chip companies and hold approved SoC partner status at all top 4 global foundries.
Join us at SEMICON Southeast Asia 2026 to explore how our Chip2Intelligence approach is helping semiconductor leaders move from incremental improvement to transformational outcomes — and why Southeast Asia is at the heart of that journey.
Meet Us at SEMICON SEA 2026
Focus Areas
End-to-End Engineering — From Spec to Platform, NPD to Lifecycle Ownership
HCLTech is the only semiconductor engineering SI that bridges chip and equipment, design and manufacturing, new product development and installed base optimization. For chip companies, our Spec-to-Platform approach covers the full silicon journey — from product specification through front-end and back-end design, FPGA emulation, pre-silicon validation, advanced packaging, production testing and qualification. For equipment OEMs, we deliver comprehensive mechanical, electrical and software engineering — spanning new product introduction, sustaining engineering, upgrades and long-term lifecycle services including mature platform optimization.
Scaling Semiconductor Innovation Across Asia
Southeast Asia is rapidly emerging as a critical node in the global semiconductor supply chain — driven by advanced packaging demand, data center investment and national strategies like Malaysia's "Made by Malaysia" initiative. HCLTech is investing in this growth with regional delivery capability, ecosystem partnerships and a deep understanding of local market dynamics. Our engagement model — combining global engineering scale with local presence and governance — is purpose-built for semiconductor companies looking to expand capacity, diversify supply chains and unlock new market opportunities across APAC.
AI Across the Semiconductor Lifecycle
From design intelligence to factory intelligence, GenAI is reshaping every stage of the semiconductor value chain. HCLTech's AI-powered platforms — including Progenix for chip design acceleration and HCLTech AI Force for intelligent software engineering — are helping semiconductor enterprises reduce design cycles by 30–40%, optimize yield and embed intelligence into equipment and fab operations. Whether it's automated test code generation, AI-driven verification or predictive maintenance through digital twins, we bring proven, deployable AI solutions.
Redefining Value Beyond the Tool
For equipment OEMs, the next wave of growth isn't just in selling new tools — it's in owning the lifecycle. HCLTech helps equipment companies monetize their installed base through sustaining engineering, platform upgrades, field services and service-layer innovation. We drive CXO-level dialogues on lifecycle value, help build proof-led storytelling across engineering, upgrades and service and position our partners for long-term ownership of legacy and mature platforms. It's a shift from transactional engineering to strategic, annuity-driven partnership.
Solutions
Why HCLTech
Semi Engineering SI — Leading design-services player with 27+ years of unbroken semiconductor heritage
SI with Top 4 Fab SoC Partner Status — Approved SoC partner at Intel, Samsung, TSMC and GlobalFoundries with privileged PDK access
Year Relationships — Driving transformation for all of the top 5 Equipment Companies, 8 of the top 10 Chip companies and 3 of the top 4 ISVs
Engineers driving R&D breakthroughs
Tapeouts across multiple foundries and process nodes
First Silicon Success Rate
Highest Investments — Customer Labs, 10k Clean Room, Solution Frameworks
Chip-to-Cloud, Spec-to-Platform — the only SI that bridges chip design and equipment engineering with proprietary solution frameworks
Client Testimonials
Analyst Accolades
HCLTech recognized as a Leader in Everest Group's Semiconductor Engineering Services PEAK Matrix Assessment 2024
詳細を見るHCLTech recognized as a Leader in ISG Digital Engineering Services, 2024
詳細を見るHCLTech rated Customers' Choice in all six active Gartner Peer Insights Voice of the Customer reports
詳細を見るHCLTech wins Intel's EPIC Outstanding Supplier Award
詳細を見る
Let's Engineer What's Next — Together
Meet our semiconductor leaders at Booth #3193 to explore how HCLTech is helping the world's leading equipment OEMs and chip companies harness AI, scale engineering and own outcomes end-to-end. Book your meeting today.