Chip2Intelligence: Engineering Tomorrow’s Semiconductor Ecosystem, End-to-End

Overview

The is entering a defining phase of growth, driven by , next-generation computing, advanced packaging and the expansion of manufacturing capacity. SEMICON West 2026 brings together the global microelectronics ecosystem to address these priorities while advancing smart manufacturing, supply chain resilience, sustainability and workforce development. 

At HCLTech, we bring more than 30 years of semiconductor heritage, with end-to-end engineering capabilities spanning chip design, equipment engineering, manufacturing and lifecycle services. Our Spec-to-Platform model connects product specification, design, verification, advanced packaging, production testing and post-silicon qualification, helping semiconductor enterprises accelerate development and achieve first-time-right outcomes. 

Through Chip2Intelligence, HCLTech combines deep semiconductor engineering expertise with AI-powered platforms and intelligent automation. We work with 8 of the top 10 semiconductor equipment OEMs, 8 of the top 10 chip companies and hold approved SoC partner status with all top four global foundries. Meet us at SEMICON West 2026 to explore how HCLTech is enabling faster innovation, smarter manufacturing and connected engineering across the semiconductor value chain.

Meet Us at SEMICON West 2026

Extending Semiconductor Intelligence Across Industries

Semiconductor innovation increasingly determines how industries differentiate, scale and create new digital experiences. HCLTech extends its chip, embedded engineering, AI, cloud, connectivity and product modernization capabilities beyond traditional semiconductor enterprises to help organizations build smarter products and platforms. Our Semi-to-Non-Semi approach connects silicon-level expertise with industry-specific engineering across automotive, hyperscalers, telecom and healthcare.

Section CTA

Automotive

As vehicles become increasingly connected, autonomous and software-defined, HCLTech helps automotive companies accelerate innovation across vehicle electronics, embedded systems and next-generation mobility platforms. Our expertise spans MCUs, Battery Management Systems (BMS), ADAS and Software-Defined Vehicles (SDVs).

Capabilities: Software-Defined Vehicles (SDV), Battery Management Systems (BMS), ADAS, Automotive MCUs, Connected Mobility Platforms

Hyperscalers

The rise of AI and cloud computing is driving unprecedented demand for high-performance infrastructure. HCLTech supports hyperscalers with advanced semiconductor, networking and platform engineering capabilities that power next-generation data centers and AI-ready ecosystems.

Capabilities: Custom Silicon, SmartNIC Engineering, Data Center Platforms, High-Performance Networking, AI Infrastructure

Telecom

Telecom providers are evolving toward open, cloud-native and AI-enabled networks. HCLTech combines semiconductor and software expertise to help accelerate network transformation across Open RAN, 5G/6G, edge computing and intelligent network platforms.

Capabilities: Open RAN, 5G & 6G, Network Processors, SmartNICs, Edge Computing, Network Automation

Healthcare

Healthcare innovation increasingly depends on intelligent, connected and secure medical technologies. HCLTech enables next-generation healthcare solutions through expertise in medical devices, wearables, implantables, remote monitoring and AI-powered diagnostics.

Capabilities: Wearables, Implantables, Connected Medical Devices, Remote Patient Monitoring, AI-Powered Diagnostics

Focus Areas

Spec to Platform — End-to-End Chip Engineering

HCLTech's Spec-to-Platform model covers the complete silicon journey from initial product specification and architecture through front-end and back-end design, FPGA emulation, pre-silicon validation, advanced packaging, production testing and post-silicon qualification. One integrated team owns outcomes from the first RTL line to production-ready silicon, eliminating handoff risk and delivering the IP continuity that fragmented engagement models cannot provide. HCLTech is the only semiconductor engineering SI that bridges chip and equipment, design and manufacturing, new product development and installed base optimization.

One Engineering Partner. End-to-End.

HCLTech brings a unified engineering model spanning silicon, parts, platforms and manufacturing. Our Spec-to-Platform approach enables customers to engage a single engineering partner across the entire semiconductor lifecycle, reducing complexity and accelerating outcomes.

Key Highlights

  • Spec-to-Silicon, Parts and Platform solutions with a proven track record
  • Manufacturing enablement, fab operations and yield optimization
  • NPD to lifecycle ownership for equipment platforms
AI Across the Semiconductor Value Chain

Artificial Intelligence is reshaping semiconductor engineering, manufacturing and operations. HCLTech embeds AI throughout the semiconductor value chain, enabling faster design cycles, greater automation and improved engineering productivity.

Key Highlights

  • 30% cycle time reduction across the silicon development lifecycle
  • Intelligent equipment software engineering and platform automation
  • Auto test flow generation for post-silicon and manufacturing test
Driving Innovation Through Strategic Partnerships & Global Scale
  • €19M Investment in Advanced Semiconductor Engineering Infrastructure
  • 40,000 sq. ft. Advanced Semiconductor Lab for Post-Silicon Validation & Testing
  • Scalable Engineering Excellence Across the Globe
  • 10+ dedicated labs worldwide, including a GenAI Lab in Singapore
  • 60+ customer equipment platforms operational

Solutions

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AIForce.Semi - AI-assisted Chip Design Acceleration

AIForce.Semi - AI-assisted Chip Design Acceleration

HCLTech's AIForce.Semi is an LLM-assisted chip design platform that delivers accurate, design-aware AI, grounded in a verified SoC Knowledge Graph. This enables near-zero hallucination and outputs that the engineers can trust. Powered by eight specialized agents built for the chip lifecycle, it also achieves 25% lower token usage through relationship-aware retrieval. The platform spans RTL, verification, synthesis/SDC, physical design and silicon validation. For semiconductor companies, this means faster engineering, lower costs, reduced review effort and reusable design knowledge that compounds across projects over time

Spec-to-Parts Platform

Spec-to-Parts Platform

Seamless, end-to-end silicon development from initial product concept through to high-volume production. HCLTech's platform-driven approach ensures faster design realization and first-time-right results covering design verification, physical design, FPGA prototype and emulation, pre-silicon validation, advanced packaging, production testing and post-silicon qualification. This integrated, accountable model eliminates handoff risk and provides European chip companies with the engineering continuity they need to compete on a global node roadmap.

AI-Driven Smart Manufacturing and Yield Optimization

AI-Driven Smart Manufacturing and Yield Optimization

Maximize fab and OSAT efficiency with AI-powered digital twins. Our solutions deliver real-time monitoring, predictive maintenance, AI-driven process control and defect detection — reducing downtime, improving yield and enabling higher profitability across semiconductor manufacturing operations. As European fabs ramp up advanced nodes, intelligent manufacturing capability is a non-negotiable differentiator.

Turnkey Equipment Engineering and Lifecycle Services

Turnkey Equipment Engineering and Lifecycle Services

End-to-end equipment engineering from new product development through sustaining engineering, mature platform optimization and aftermarket services. HCLTech takes full accountability from design to deployment, shifting the model from staff augmentation to outcome-based delivery across mechanical, electrical and software engineering domains. This model is particularly relevant for European equipment OEMs seeking to extend value from their global installed base while investing in next-generation tool development.

AI Force for Semiconductor Software Engineering

AI Force for Semiconductor Software Engineering

An advanced AI and ML-based solution for intelligent software development and testing. Using GenAI technologies, AI Force augments development and test teams across semiconductor enterprises, enabling faster cycles, higher-quality code and lower costs for equipment software, control systems and automation platforms. For European OEMs managing complex, multi-generational software stacks, AI Force provides a scalable path to modernization without compromising schedule commitments.

Why HCLTech

#1

Semi Engineering SI — Leading design-services player with over 30 years of unbroken semiconductor heritage

Only

SI with Top 4 Fab SoC Partner Status — Approved SoC partner at Intel, Samsung, TSMC and GlobalFoundries with privileged PDK access

20+

Year Relationships — Driving transformation for all of the top 5 Equipment Companies, 8 of the top 10 Chip companies and 3 of the top 4 ISVs

45,000+

Engineers driving R&D breakthroughs

230+

Tapeouts across multiple foundries and process nodes

95%

First Silicon Success Rate

₹1320Cr+

Highest Investments — Customer Labs, 10k Clean Rooms, Solution Frameworks

End-to-End

Chip-to-Cloud, Spec-to-Platform — the only SI that bridges chip design and equipment engineering with proprietary solution frameworks

Client Testimonials

HCLTech has been a strategic partner, delivering critical engineering services that have significantly contributed to Teradyne's success. HCLTech’s engineering teams have been integral to Teradyne's product development, sustenance and support. Our collaboration has spanned multiple platforms, including UltraFLEXplus, UltraFLEX, J750 and ETS. To further strengthen this partnership, HCLTech has established dedicated Teradyne labs in India, equipped with Teradyne testers to support training and product development efforts.”

Roy Chorev

VP Semiconductor Test, Product Development at Teradyne, Inc.

At Eugenus, we pride ourselves on driving innovation in semiconductor equipment and HCL Tech has been a crucial partner in helping us achieve our goals. The HCLTech engineering team has demonstrated exceptional technical expertise, significantly enhancing our equipment through their expertise in semiconductor technologies. Their deep understanding of semiconductor technologies, combined with their ability to collaborate closely with our internal teams, has contributed to several successful projects.”

Dr. Tejinder Singh, Ph.D., MBA

Chief Technology Officer, Eugenus, Inc.

We have been working with HCLTech for over 20 years and I must say that their service has been nothing short of exceptional. The quality of their services is top-notch and their customer service is always prompt and friendly. Their meticulous attention to detail and unwavering commitment to delivering high-quality results are truly commendable. They have consistently met our requirements and adapted to our needs with remarkable flexibility. I highly recommend HCLTech to anyone looking for reliable and high-quality services.”

Shital R Patel

Vice President Axcelis Technologies, Inc.

As Intel transforms the world’s premier systems foundry for the AI era, HCLTech will play a significant role in delivering our winning strategy. HCLTech’s long-standing commitment to safety, quality, affordability, innovation, supplier diversity and sustainability sets a global benchmark for emulation."

Keyvan Esfarjani

Chief Global Operations Officer, Intel

Our Leaders at Semicon West

Ameer Saithu
Ameer Saithu

Executive Vice President and Head, Global Semiconductor Business
HCLTech

Ramanuja V
Ramanuja V

Global Delivery Head, Semiconductor Business
HCLTech

Biju Nambisan
Biju Nambisan

Senior Vice President, Global Semiconductor and OEM Segment
HCLTech

Tarun Punhani
Tarun Punhani

Sales Head, Global Semiconductor Chip Business
HCLTech

Satish Premanathan
Satish Premanathan

Senior Vice President- Semi Sales 
HCLTech

Haris Farooq
Haris Farooq

Client portfolio Leader- Semi Sales 
HCLTech

ERS 半導体工学 イベント SEMICON West 2026: Shaping the Future of Silicon