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SEMICON India 2026

Overview

India's semiconductor story is entering its most decisive chapter yet.

Backed by the ₹1.28 lakh crore Semicon 2.0 outlay and the India Semiconductor Mission, the country is moving from policy to production — new fabs, the first outsourced semiconductor assembly and test (OSAT) facilities and a display-driver ecosystem taking shape around hubs like YEIDA. The opportunity to build capacity and manufacture in India has never been greater.

HCLTech brings 30+ years of heritage across chip and equipment lifecycles, powered by AI platforms already transforming the world's leading semiconductor enterprises. This year, that heritage stands beside India Chip — HCL Group's ₹3,706 crore joint venture with Foxconn, building India’s first Display Driver Focussed OSAT facility in Jewar, Uttar Pradesh.

Join us at Booth 946, SEMICON India 2026, to see how and India Chip are moving India's semiconductor ecosystem from ambition to execution.

SEMICON India 2026

Focus Areas

Chip

End-to-end spec to silicon & platform, AI – accelerated turnkey development

We cover the full silicon and platform lifecycle, including architecture, RTL design, verification, emulation/prototyping, DFT, physical implementation, post-GDSII services — packaging and testing and post-silicon validation and platform enablement — delivering 230+ tapeouts with a 95% first-silicon success rate.

Equipment

NPD to lifecycle ownership for semiconductor equipment platforms

We deliver mechanical, electrical and software engineering for equipment OEMs, from new product introduction to sustaining engineering and upgrades — shifting to a strategic, annuity-driven partnership.

Fab and OSAT

Manufacturing enablement, operations and yield optimization

We maximize fab and OSAT efficiency with AI-powered digital twins—real-time monitoring, predictive maintenance, process control and defect detection — reducing downtime and improving yield.

India Chip: Manufacturing India's Silicon

From engineering the world's silicon to manufacturing India's own

India Chip — HCL Group's ₹3,706 crore joint venture with Foxconn — builds display driver ICs at 20,000 wafers/ 36 million chips per month in Jewar, Uttar Pradesh a flagship of the India Semiconductor Mission.

AI-Powered Innovation

AI Across the Semiconductor Lifecycle.

GenAI reshapes every stage of the silicon value chain - powered by Progenix for accelerating chip development and AI Force for intelligent software engineering - reducing design cycles and optimizing yield.

Solutions

Progenix - AI-assisted chip design acceleration

Progenix - AI-assisted chip design acceleration

Harness GenAI to transform semiconductor development. Leveraging an agent-driven framework to accelerate design, verification, emulation, DFT, physical design and post-silicon validation — reducing design cycles significantly and improving first-time-right execution. (Live demo at Booth 946.)

Spec-to-parts platform

Spec-to-parts platform

Seamless, end-to-end silicon development from concept to high-volume production — leveraging reusable SoC platforms, sub-systems, IPs and hard macros to address various market segments such as consumer electronics, automotive, networking, high-performance computing (HPC), edge computing and physical AI.

AI-driven smart manufacturing and yield optimization

AI-driven smart manufacturing and yield optimization

Maximize fab and OSAT efficiency with AI-powered digital twins — real-time monitoring, predictive maintenance, AI-driven process control and defect detection.

AI Force for semiconductor software engineering

AI Force for Semiconductor Software Engineering

GenAI-powered intelligent software development and testing for equipment software, control systems and automation platforms. (AIForce. demo live at Booth 946.)

India Chip OSAT - Display driver IC manufacturing

India Chip OSAT - Display driver IC manufacturing

India's newest display-driver-focused OSAT facility, under construction at YEIDA — a joint venture between HCL Group and Foxconn, and a flagship project of the India Semiconductor Mission.

India Chip

The Chip Behind Every Screen, Made in India

Established to advance India's semiconductor manufacturing capabilities, India Chip, the HCL-Foxconn joint venture, represents a significant milestone in the nation's semiconductor ecosystem — a cornerstone project within the Government of India's India Semiconductor Mission (ISM), Make in India and Digital India frameworks.

The facility in Jewar, Uttar Pradesh, will be India's first OSAT facility dedicated to Display Driver IC (DDIC) technology — the semiconductors that power every screen, from mobile devices and tablets to televisions and automotive dashboards. The foundation stone was laid by the Hon'ble Prime Minister, Shri Narendra Modi.

Core Services:

  • Wafer Level Packaging
  • Chip Probing
  • Die Processing
Learn more
India Chip

Why HCLTech

#1

Semiconductor engineering SI — over 30 years of unbroken heritage

Only

SI with Top 4 Fab SoC partner status

230+

Tapeouts across multiple foundries and process nodes

95%

First silicon success rate

₹3,706 Cr

India Chip — HCL–Foxconn JV, flagship of the India Semiconductor Mission

End-to-End

Chip-to-cloud, spec-to-platform — and now, manufacturing in India

Our Leaders at Semicon India

Ameer Saithu
Ameer Saithu

Executive Vice President and Head, Global Semiconductor Business,
HCLTech

Abhinav Gosh
Abhinav Gosh

Sr. Vice President Strategy,
HCLTech

Let's Build What's Next — Together

Meet our team at Booth 946 to explore how we and India Chip are helping India's semiconductor ecosystem move from policy to production — from AI-powered engineering to manufacturing on the ground.

Book your meeting today.

ERS Semiconductor Engineering Event SEMICON India 2026