Turnkey Silicon

Next-gen auto needs next-gen silicon

Software-defined vehicles, ADAS, and Electrification are redefining the future of mobility. Traditional ECU-based systems are giving way to centralized compute platforms, where silicon is the true control center.

To compete, automakers need chips that are high-performance, power-efficient, AI-ready, and scalable to keep pace with evolving architectures.

This shift is driving a surge in custom silicon adoption. Automakers and Tier-1s are building their own chips not just for performance, but to gain differentiation, control, and resilience.

The need is driven by:

  • Rising system complexity and demand for integration
  • Pressures on safety, performance, and power efficiency
  • Desire to own IP and reduce BoM costs
  • Supply chain disruptions and geopolitical shifts

HCLTech brings decades of semiconductor expertise, from working with leading chipmakers to delivering silicon at scale. Now, we enable automotive innovators to co-create custom chips, accelerate time-to-market with proven frameworks and deliver differentiated experiences built on silicon-level innovation.

With Turnkey Silicon, HCLTech bridges chip to car, giving automakers the edge to lead in the era of smart, software-driven mobility.

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Overview

Our Turnkey Advantage

HCLTech’s Turnkey Silicon model is built for automotive value creation and flexibility. From design architecture to high-volume manufacturing, we offer:

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Full-stack silicon delivery

From specification to packaged parts

Flexible handoff models

Architecture, RTL, Netlist, GDS

Vendor ecosystem orchestration

EDA, IP, fabs, OSAT, ATMP labs

Proven delivery

In global markets, with US and India-based execution

Supply chain control

Enabling compliance and predictability

Functional safety expertise

ISO 26262–compliant design, verification, and validation for automotive-grade silicon

Purpose-built silicon for next-gen vehicles

From electric powertrains to AI-driven driver assistance, HCLTech collaborates with OEMs and Tier-1s across:

  • Central and zonal compute architectures
  • Multi-die custom packages
  • Integration of AI/ML accelerators
  • Automotive-grade validation & compliance
  • ECU consolidation

Whether you are prototyping a breakthrough or refreshing legacy platforms, HCLTech helps you reduce TCO, secure IP, and build silicon that's fit for your vehicle roadmap

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Purpose-built silicon for next-gen vehicles

Accelerating Custom Silicon with Proven Platforms

HCLTech offers ready-to-use silicon platforms as starting points for rapid custom chip development. Whether for single ECUs, Electrification, e-Mobility, Digital Cockpits, ADAS, or Zonal Compute in SDVs, our experts work with your teams to adapt the right platform to your vehicle architecture.

These platforms come with pre-validated flows and reference designs, enabling:

  • Faster design cycles
  • Reduced risk
  • Accelerated time-to-market
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Accelerating Custom Silicon with Proven Platforms

AI-Powered Chip Design Acceleration

As semiconductor complexity grows, AI-driven systems are transforming chip development by automating specification analysis, test generation, and functional verification. This reduces bottlenecks, improves design efficiency by 50-60%, and accelerates time-to-market with greater accuracy.

Watch the video to explore how Progenix, our AI-based chip design accelerator, is transforming semiconductor design—making it smarter, faster, and more efficient.

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Central Compute for Next-Gen Vehicles

As vehicles evolve into software-defined platforms, central compute becomes the brain of mobility. HCLTech enables custom, multi-die architectures that integrate CPUs, GPUs, accelerators, and connectivity — delivering the performance, scalability, and efficiency required for next-gen automotive systems.

HCLTech has partnered with Intel which combines Intel’s cutting-edge automotive chiplet technology with HCLTech’s world-class engineering services, bringing automakers a game-changing solution to:

  • Unlock the full potential of custom, scalable hardware
  • Accelerate development timelines to get vehicles to market faster
  • Transform SDVs with seamless integration of advanced hardware and software

This collaboration marks a major leap forward for the automotive industry, redefining central compute and driving the future of SDVs, electrification, and intelligent mobility.

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Central Compute for Next-Gen Vehicles

With supply chain shifts, timing is everything

Tomorrow’s automotive chip strategy needs more than design, it needs agility, compliance and scale.

That’s what HCLTech delivers, enabling global customers to navigate:

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Migration away from Chinese fabs

Localized ATMP options for control and resilience

Strategic fab partnerships (TSMC, GF, IFS, Samsung)

40+ vetted IP vendors integrated in our ecosystem

Results that matter 

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Custom silicon market projected to grow from $32B (2023) to $47B (2027)

Up to 30% reduction in BoM cost by silicon integration

Time-to-market accelerations up to 2x vs traditional sourcing models

Long-tail revenue growth with dedicated ownership models

Book a Strategy Session

Let’s take charge of the future together. Whether you’re just exploring custom silicon or automotive innovation or already running multi-node chip programs, HCLTech brings the expertise, ecosystem, and execution scale to meet your goals.

ERS Semiconductor Engineering Campaign Turnkey Silicon: The road ahead in software-driven mobility