Empowering Next-Generation Automotive Innovation
The rise of software-defined vehicles is accelerating a shift towards centralized, high-performance and compute-intensive architectures, transforming vehicles into dynamic digital platforms. At the heart of this transformation is the growing reliance on innovative semiconductor solutions that align with the diverse silicon strategies of automotive OEMS and TierX, that are seeking to balance performance, costs, scalability and time-to-market across vehicle segments. Silicon agility will be the key to competitive advantage and redefining future mobility.
At HCLTech, we’re working closely with automotive OEMs, Semiconductor Providers and Tier Xs to navigate this complexity. With deep semiconductor domain expertise, a global engineering workforce of 7,000+ and a track record of supporting over 400 automotive programs, HCLTech offers end-to-end engineering solutions from architecture definition to silicon platform integration – accelerating innovation, reducing development cycles and enabling future-ready SDV programs.
Our Services
Silicon and Hardware System Services
- Full-stack Silicon development: From Spec-to-GDSII, including validation and production
- Proven track record: Achieved 95% first silicon success across 200+ tapeouts. Multiple SoCs Targeted to Body Electronic MCUs, ECU MCUs, Domain/Zone controllers MCUs and HPC Platforms.
- Tailored engagement models: Customized for OEMs like Volvo, including branded MCUs/SoCs
Software Defined Vehicle (SDV) Solutions
- SDV stack encompasses SoC, OS, middleware, containerization, OTA and domain-specific modules
- It integrates AI/ML accelerators, secure boot mechanisms and diagnostics capabilities
- We maintain strategic partnerships with Qualcomm, Intel, Renesas, NXP, ARM and Samsung
Electrification and E-Mobility
- Modular Battery Management Systems (BMS) designed with wide voltage range and built-in redundancy
- Vehicle Control Unit (VCU) development aligned with ASIL-C compliance for functional safety
- Proprietary secure bootloader, delivering cost savings ~$600K for customers
Infotainment and Digital Cockpit
- Multi-variant IVI platforms supporting CarPlay, Android Auto and voice assistants
- EMI/ESD with advanced design tools including Zuken, HFSS and PSpice
- Delivered a first-in-market digital cockpit integrating with ADAS and DMS
ADAS Engineering
- Developed a Radar SoC featuring dual-die architecture, ASIL-B compliance and a 2GHz clock speed
- Implemented a functional safety mechanism using Austemper tools and Cadence Xcelium
- Engineered ADAS features such as ACC, AEB and LKA with 30% effort savings
Custom Hardware Platforms
- End-to-end board design compliant with AECQ100/ISO26262 standards
- Enabled multi-SoC integration and rapid prototyping capabilities
- Built strategic alliances within Volvo’s chip and hardware ecosystem
Engagement Models
Frequently Asked Questions about Automotive Semiconductor Solutions
We've successfully completed 200+ automotive tapeouts, achieving a 95% first silicon success rate. Our tapeout experience spans body electronics MCUs, ECU MCUs, domain and zone controllers and HPC platforms—giving us a proven track record of navigating complex silicon challenges and delivering reliable results across diverse automotive programs.
We support multiple ASIL compliance levels across our automotive programs. Our electrification work includes ASIL-C-compliant vehicle control unit development, while our ADAS engineering delivers ASIL-B-compliant radar SoCs. This functional safety expertise, aligned with ISO 26262, ensures our silicon solutions meet rigorous automotive safety requirements across diverse applications.
Our proprietary secure bootloader delivers approximately $600K in savings per deployment. Beyond the financial impact, it provides robust cybersecurity protection integrated directly into the vehicle's electrification stack—combining diagnostics, fast prototyping and ASIL-C compliance to help clients launch safer, more cost-efficient automotive platforms with confidence.
Yes, we have hands-on experience managing complex MCU migrations within AUTOSAR environments. A strong example is our rapid migration from Infineon to NXP for a driver monitoring system, fully supporting AUTOSAR 4.0.3 and 4.4.3. Our engineers handle architecture alignment, software stack continuity and validation to minimize program risk throughout the transition.
We've supported 400+ automotive programs, backed by a team of 7,000+ engineers. This breadth of experience spans OEMs, semiconductor vendors and Tier X suppliers—covering everything from concept architecture to integrated silicon delivery across electrification, ADAS, infotainment, body electronics and software-defined vehicle initiatives.
We maintain trusted partnerships with industry leaders, including Qualcomm, Intel, Renesas, NXP, ARM and Samsung. These relationships give our clients direct access to cutting-edge silicon ecosystems, enabling faster integration, stronger technical alignment and collaborative development that accelerates time-to-market for automotive semiconductor programs.
Absolutely. We offer flexible, custom engagement models—including branded MCU and SoC design tailored to individual OEM requirements. Our collaboration with Volvo demonstrates this capability directly, encompassing chip and hardware co-development within their ecosystem. This approach gives OEMs meaningful silicon differentiation without the overhead of building inhouse design teams.
We've invested $110M+ across 10+ global labs dedicated to automotive silicon development and validation. These advanced facilities support EMI/EMC compliance testing, hardware-in-loop simulation and autonomous vehicle testing—ensuring our engineering teams are equipped to tackle every technical challenge your program demands, from early prototyping through production readiness.
We've engineered a broad range of ADAS features, including adaptive cruise control (ACC), automatic emergency braking (AEB) and lane-keeping assist (LKA). Using advanced safety mechanisms with Austemper and Cadence Xcelium, we've achieved a 30% reduction in engineering effort—delivering a first-in-market digital cockpit integrated with ADAS and driver monitoring systems.
Our GenAI-assisted chip development platform delivers up to a 30% improvement in productivity, helping engineering teams move faster without the bottlenecks that typically slow silicon development cycles. By embedding AI-driven automation into the design workflow, we help clients accelerate tapeouts, reduce iteration time and bring competitive automotive silicon to market more efficiently.